Effect of glue on reliability of flip chip BGA packages under thermal cycling

被引：36

作者：

Nguyen, Tung T. ^{[1
]}

Lee, Donggun ^{[1
]}

Kwak, Jae B. ^{[1
]}

Park, Seungbae ^{[1
]}

机构：

[1] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA

来源：

MICROELECTRONICS RELIABILITY | 2010年 / 50卷 / 07期

关键词：

D O I：

10.1016/j.microrel.2010.04.003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Glue is widely used to improve the reliability of ball grid array (BGA) under mechanical shock and vibration. Although it has been demonstrated to have a positive effect on the reliability of BGA under mechanical impact, it can have adverse effects on BGA under thermal cycling. This paper investigates the effect of glue on the reliability of BGA under thermal cycling using both experimental and numerical methods. The digital image correlation (DIC) technique was used to obtain the thermal mechanical behavior of the package. The experimental results explain in detail how the glue negatively affects the reliability of the BGA. Furthermore, a finite element analysis was performed and its results were verified with experimental results. A numerical parametric study was carried out on various mechanical properties, configurations of the glue, and introduction of a stiffener using the validated FEM model. The results show that the reliability of BGA strongly depends on geometries and material properties of the glue. Based on the results, a guideline of glue selection for BGA reliability under thermal cycling is formulated. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：1000 / 1006

页数：7

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