Filling efficiency of flip-chip underfill encapsulation process

被引:13
|
作者
Ng, Fei Chong [1 ]
Abas, Mohamad Aizat [2 ]
Abdullah, Mohd Zulkifly [1 ]
机构
[1] Univ Sains Malaysia, Sch Mech Engn, Minden, Malaysia
[2] Univ Sains Malaysia, Sch Mech Engn, George Town, Malaysia
关键词
Flip-chips; Scaling; Electronic packaging; Filling efficiency; Underfill encapsulation; CONTACT-ANGLE; FLOW; ARRAY;
D O I
10.1108/SSMT-07-2019-0026
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Purpose - This paper aims to introduce a new indicative parameter of filling efficiency to quantify the performance and productivity of the flip-chip underfill encapsulation process. Additionally, the variation effect of the bump pitch of flip-chip on the filling efficiency was demonstrated to provide insight for flip-chip design optimization. Design/methodology/approach - The filling efficiency was formulated analytically based on the conceptual spatial and temporal perspectives. Subsequently, the effect of bump pitch on filling efficiency was studied based on the past actual-scaled and current scaled-up underfill experiments. The latter scaled-up experiment was validated with both the finite volume method-based numerical simulation and analytical filling time model. Moreover, the scaling validity of scaled-up experiment was justified based on the similarity analysis of dimensionless number. Findings - Through the scaling analysis, the current scaled-up experimental system is justified to be valid since the adopted scaling factor 40 is less than the theoretical scaling limit of 270. Furthermore, the current experiment was qualitatively well validated with the numerical simulation and analytical filling time model. It is found that the filling efficiency increases with the bump pitch, such that doubling the bump pitch would triple the efficiency. Practical implications - The new performance indicative index of filling efficiency enables the package designers to justify the variation effect of underfill parameter on the overall underfill process. Moreover, the upper limit of scaling factor for scaled-up package was derived to serve as the guideline for future scaled-up underfill experiments. Originality/value - The performance of underfill process as highlighted in this paper was never being quantified before in the past literatures. Similarly, the scaling limit that is associated to the scaled-up underfill experiment was never being reported elsewhere too.
引用
收藏
页码:10 / 18
页数:9
相关论文
共 50 条
  • [1] Experimental study of filling behaviors in the underfill encapsulation of a flip-chip
    Shih, Meng-Fu
    Young, Wen-Bin
    [J]. MICROELECTRONICS RELIABILITY, 2009, 49 (12) : 1555 - 1562
  • [2] Underfill Flow in Flip-Chip Encapsulation Process: A Review
    Ng, Fei Chong
    Abas, Mohamad Aizat
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2022, 144 (01)
  • [3] Computational simulation of flip-chip underfill encapsulation process
    Gao, ZH
    Xue, H
    Liu, GR
    Cui, CQ
    [J]. HEAT TRANSFER SCIENCE AND TECHNOLOGY 2000, 2000, : 569 - 573
  • [4] A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
    Fei Chong Ng
    M. Yusuf Tura Ali
    Aizat Abas
    C. Y. Khor
    Z. Samsudin
    M. Z. Abdullah
    [J]. The International Journal of Advanced Manufacturing Technology, 2019, 105 : 3521 - 3530
  • [5] Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process
    Ng, Fei Chong
    Abas, Aizat
    Nashrudin, Muhammad Naqib
    Tura Ali, M. Yusuf
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2022, 34 (04) : 193 - 202
  • [6] A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
    Ng, Fei Chong
    Ali, M. Yusuf Tura
    Abas, Aizat
    Khor, C. Y.
    Samsudin, Z.
    Abdullah, M. Z.
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 105 (7-8): : 3521 - 3530
  • [7] Three-dimensional simulation of underfill process in flip-chip encapsulation
    Wang, Hui
    Zhou, Huamin
    Zhang, Yun
    Li, Dequn
    Xu, Kai
    [J]. COMPUTERS & FLUIDS, 2011, 44 (01) : 187 - 201
  • [8] Study on underfill/solder adhesion in flip-chip encapsulation
    Fan, LH
    Tison, CK
    Wong, CP
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (04): : 473 - 480
  • [9] Spatial analysis of underfill flow in flip-chip encapsulation
    Ng, Fei Chong
    Zawawi, Mohd Hafiz
    Abas, Mohamad Aizat
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2021, 33 (02) : 112 - 127
  • [10] Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
    Lee, Seong Hyuk
    Lee, Hyung Jun
    Kim, Jong-Min
    Shin, Young Eui
    [J]. MATERIALS TRANSACTIONS, 2011, 52 (10) : 1998 - 2003