Halogen-free Microwave Induced Plasma Decapsulation of System in Package Modules

被引：0
|
作者：
Tang, J. [1 ]
Wang, J. [1 ]
Dixon-Warren, St. J. [2 ]
Beenakker, C. I. M. [3 ]
机构：
[1] JIACO Instruments, Feldmannweg 17, NL-2628 CT Delft, Netherlands
[2] TechInsights Inc, 1891 Robertson Rd,Suite 500, Ottawa, ON K2H 5B7, Canada
[3] Delft Univ Technol, Mekelweg 4, NL-2628 CD Delft, Netherlands
来源：
ISTFA 2017: CONFERENCE PROCEEDINGS FROM THE 43RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS | 2017年
关键词：
D O I：
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中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：567 / 573
页数：7
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