Cross-sectional nanoindentation for thin film interfacial adhesion characterization

被引:0
|
作者
Elizalde, MR
Moreno, JMS
Esnaola, JMM
Meizoso, AM
Sevillano, JG
Maiz, J
机构
[1] CEIT, San Sebastian 20018, Spain
[2] Escuela Super Ingn, San Sebastian 20080, Spain
[3] Intel Corp, Hillsboro, OR 97124 USA
关键词
thin films; interfacial adhesion; nanoindentation;
D O I
10.3989/cyv.2000.v39.i3.848
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Cross sectional nanoindentation (CSN) is a technique recently developed to study thin film interface decohesion in a microscopic scale. Controlled interfacial microcracks are induced at the interfaces of interest by indenting in a cross section of a multilayer thin film structure. The correlation between the observed cracking phenomena and the corresponding load vs, indenter tip displacement curves is discussed. An additional benefit of the CSN technique is the low scatter of results obtained for the mean interfacial crack lengths produced by identical tests. The observation of the interfacial crack front by scanning electron microscopy shows clear differences between the interfacial fracture micro-mechanisms present in samples with good and bad adhesion behaviour.
引用
收藏
页码:319 / 322
页数:4
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