Interfacial fracture induced by cross-sectional nanoindentation in metal-ceramic thin film structures

被引:37
|
作者
Elizalde, MR
Sánchez, JM
Martínez-Esnaola, JM
Pantuso, D
Scherban, T
Sun, B
Xu, G
机构
[1] Ctr Estudios & Invest Tecn Gipuzkoa, CEIT, San Sebastian 20018, Spain
[2] Univ Navarra, TECNUN, Escuela Super Ingenieros, San Sebastian 20080, Spain
[3] Intel Corp, Log Technol Dev, Hillsboro, OR 97124 USA
[4] Intel Corp, Calif Technol & Mfg, Santa Clara, CA 95051 USA
关键词
thin films; interfaces; fracture; adhesion energy; nanoindentation;
D O I
10.1016/S1359-6454(03)00256-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The cross-sectional nanoindentation (CSN) technique is extended to examine the fracture properties of thin film metal-ceramic interfaces. The methodology includes the selection of appropriate indentation parameters to achieve controlled interfacial delamination together with finite element modelling to estimate the contribution of plasticity of the metallic film to the overall interfacial fracture process. The results show good agreement with four-point bending, a method commonly used to measure thin film interfacial toughness, provided that mode mixities are similar. In addition, CSN allows observation of the interfacial crack by scanning electron microscopy and a local measurement of adhesion, with debonded areas in the range of 100-1000 mum(2). The numerical modelling of the test provides an estimate of the intrinsic inter-facial adhesion energy, separating the effects of metal plasticity. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:4295 / 4305
页数:11
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