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Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

被引：0
|
作者：
Scherban, T. [1 ]
Pantuso, D. [1 ]
Sun, B. [2 ]
El-Mansy, S. [1 ]
Xu, J. [1 ]
Elizalde, M.R. [3 ]
Sánchez, J.M. [3 ]
Martínez-Esnaola, J.M. [3 ]
机构：
[1] Intel Corporation, 2501 NW 229th Ave., Hillsboro, OR 97124, United States
[2] Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95051, United States
[3] CEIT, TECNUN, Paseo de M. Lardizábal 15, San Sebastián 20018, Spain
来源：
International Journal of Fracture | 2003年 / 120卷 / 1-2期
关键词：
D O I：
10.1023/a:1024931913643
中图分类号：
学科分类号：
摘要：
Fracture
引用
收藏
页码：421 / 429
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