IN-SITU OVENIZATION OF LAME-MODE SILICON RESONATORS FOR TEMPERATURE COMPENSATION

被引：0
|
作者：
Chen, Yunhan [1 ]
Ng, Eldwin J. [1 ]
Yang, Yushi [1 ]
Ahn, Chae Hyuck [1 ]
Flader, Ian [1 ]
Kenny, Thomas W. [1 ]
机构：
[1] Stanford Univ, Stanford, CA 94305 USA
来源：
2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015) | 2015年
关键词：
MICROMECHANICAL RESONATORS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper reports an inside-encapsulation ovenization method for the temperature compensation of Lame-mode epi-sealed silicon resonators. With this method, the square Lame-mode resonator itself acts both as a thermometer and a heater, which allows for simultaneous in situ sensing and control of the operating temperature. In this device, only the resonating element is heated, reducing the power consumption and the thermal time constant, relative to approaches which control the temperature of an entire MEMS chip or system. Preliminary results of real-time frequency compensation achieve a frequency stability of similar to 5ppm over -40 similar to+80 degrees C without the need for sophisticated control schemes.
引用
收藏
页码：809 / 812
页数：4
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