Modelling thermo-mechanical reliabilty of bumpless flip chip package

被引：0
|
作者：
Che, FX [1 ]
Low, TH [1 ]
Pang, JHL [1 ]
Lin, CWC [1 ]
Chiang, SCL [1 ]
Yang, TKA [1 ]
机构：
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
来源：
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Finite element modeling of thermo-mechanical reliability of a Bumpless Flip Chip Package (BFCP) was investigated. Both package-level and board-level assemblies are modeled using 2-D plane strain models. The package-level temperature cycling profile used was -65C to +150C, with 2 cycles/hour, upper and lower soak time of 10 minutes. The package survived 2000 cycles without any failures. The board level assembly test is planned and modeling is conducted for a temperature cycling profile of -40C to +125C, with 1 cycle/hour, upper and lower soak time of 15 minutes. For the package level analysis, the copper interconnection material properties were modeled using different properties from bulk Cu and electroplated Cu data. The mechanical properties of both the bulk and electroplated copper were used in the FEA simulation and the results compared. Fatigue life prediction study, using the appropriate thin-film properties of copper and the fatigue properties of thin-film copper gave reasonable predicted life. For the second level solder joint analysis, the deformation behavior of the compliant terminals with the solder joints were investigated. Visco-elastic proper-ties was used for the epoxy resin, viscoplastic properties was used for the eutectic Sn-Pb solder joints. The in elastic energy density method was used for solder joint fatigue life prediction.
引用
收藏
页码：421 / 426
页数：6
相关论文
共 50 条
  • [1] Artificial Neural Networks and Bayesian Techniques for Flip-Chip Package Thermo-Mechanical Analysis
    Sinha, Tuhin
    Sikka, Kamal
    Lall, Rahul
    [J]. IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1442 - 1449
  • [2] Thermo-Mechanical Modeling of a 3D Flip Chip Fully Populated BGA Package
    Meng, Chai Chee
    Stoeckl, Stephan
    Pape, Heinz
    Yee, Foo Mun
    Min, Tan Ai
    [J]. 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 637 - 640
  • [3] Thermo-mechanical deformation of underfilled flip-chip packaging
    Dai, X
    Ho, PS
    [J]. TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1997, : 326 - 333
  • [4] Effect of package and board pad size on optimum flip chip ball grid array (FCBGA) package thermo-mechanical performance
    Wong, CW
    Tay, CS
    Tan, SS
    Vasudevan, V
    Goh, EH
    Wong, SF
    [J]. ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 783 - 790
  • [5] Modeling plated copper interconnections in a bumpless flip chip package
    Low, TH
    Pang, JHL
    Lin, CWC
    Chiang, SCL
    Yang, TKA
    [J]. PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 791 - 796
  • [6] Thermo-mechanical deformation and stress analysis of a flip-chip BGA
    Wu, JD
    Lai, YS
    Kuo, YL
    Hung, SC
    Jen, MHR
    [J]. ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 309 - 316
  • [7] Thermo-mechanical reliability of power flip-chip cooling concepts
    Wunderle, B
    Dudek, R
    Michel, B
    Reich, H
    [J]. 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 427 - 436
  • [8] Thermo-mechanical analysis of solder joint fatigue and creep in a Flip Chip On Board package subjected to temperature cycling loading
    Pang, JHL
    Tan, TI
    Sitaraman, SK
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 878 - 883
  • [9] Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
    Pok, Y. W.
    Sujan, D.
    Rahman, M. E.
    Dol, S. S.
    [J]. 2016 THE 3RD INTERNATIONAL CONFERENCE ON MECHATRONICS AND MECHANICAL ENGINEERING (ICMME 2016), 2017, 95
  • [10] Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions
    Sham, Man-Lung
    Kim, Jang-Kyo
    Park, Joo-Hyuk
    [J]. COMPUTATIONAL MATERIALS SCIENCE, 2008, 43 (03) : 469 - 480
12345