Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure

It is known that certain faults associated with the process might be generated in any phases of the fabrication and assembly of the complex interconnection structure in a high-speed PCB composed of via holes, solder joints and traces, which will inevitably discount the electrical performance of the circuit. To address the issue, a fault-voltage detection method is proposed in this paper, firstly the equivalent fault circuit of the complex interconnection structure in high-speed PCB is scanned to extract the fault voltage, then the optimal function curve can be fitted out by the least squares method based on the faultless voltage. The empirical research on the via hole crack and solder joint void have validated that this method can effectively avoid the false tests derived under the low-frequency, major-fault and high-frequency, minor-fault conditions, and can also depict more accurately how the fault parameter varies with the changes in the frequency and fault degree, and it bears a relatively strong applicability in minor-fault of hiht-speed PCB tests.