Design characterization of microwave antenna BGA interconnect structure using test-validated physics-of-failure methods

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Boeing Co, Seattle, United States [1 ]
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Annu Proc Reliab Phys Symp | / 347-355期
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  • [1] Design characterization of microwave antenna BGA interconnect structure using test-validated physics-of-failure methods
    Pietila, DA
    Rassaian, M
    Brice-Heames, K
    1999 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 37TH ANNUAL, 1999, : 347 - 355
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