Residual Thermo-mechanical stresses in ultra thin chip stack technology

被引：1

作者：

Puigcorbé, J ^{[1
]}

Leseduarte, S ^{[1
]}

Marco, S ^{[1
]}

Beyne, E ^{[1
]}

Van Hoof, R ^{[1
]}

Marty, A ^{[1
]}

Pinel, S ^{[1
]}

Vendier, O ^{[1
]}

Coello-Vera, A ^{[1
]}

机构：

[1] Univ Barcelona, Dept Elect, E-08028 Barcelona, Spain

来源：

DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS, PROCEEDINGS | 2000年 / 4019卷

关键词：

residual stress; FEM; chip stack; creep; BCB; copper; interconnects; MCM;

D O I：

10.1117/12.382329

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The aim of this work is to analyze the thermo-mechanical stresses evolution produced during the fabrication sequence of the multi-level UTCS structure. Several non-linear material models have been taken into account during the process modeling. We have therefore resorted to the Finite Element Method for the evaluation of such thermo-mechanical stresses that appears in the manufacturing and stacking process. These efforts are made to optimize the product and process design.

引用

页码：315 / 323

页数：9

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