Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

被引：18
|
作者：
Ho, Li-Ngee [1 ]
Nishikawa, Hiroshi [1 ]
Natsume, Naohide [2 ]
Takemoto, Tadashi [1 ]
Miyake, Koichi [3 ]
Fujita, Masakazu [3 ]
Ota, Koyu [4 ]
机构：
[1] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan
[2] Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan
[3] Mitsui Min & Smelting Co Ltd, Corp R&D Ctr, Ageo, Saitama 3620021, Japan
[4] Kamioka Min & Smelting Co Ltd, Gifu 5061114, Japan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2010年 / 39卷 / 01期
关键词：
Conductive adhesive; copper; alloy; trace element; oxidation resistance; OXIDATION; POWDERS; CU; ENHANCEMENT; RESISTIVITY; FILMS; SIO2;
D O I：
10.1007/s11664-009-0946-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The properties of electrically conductive adhesives (ECAs) filled with Cu and Cu alloy fillers (with alloy elements Ag, Ge, Mg, and Zn) were investigated in terms of electrical conductivity, thermal stability, and the effects of the trace alloy elements on the oxidation resistance of the metallic fillers. Oxidation of metallic fillers under high-temperature exposure at 125A degrees C was considered as the main reason that led to degradation of electrical conductivity in the ECAs. Cu fillers alloyed with a trace amount of Ag and Mg, respectively, had significant effects on the electrical conductivity and thermal stability of the ECAs as the electrical resistivity was substantially suppressed and a consistently high electrical conductivity could be maintained even after aging for 1000 h at 125A degrees C.
引用
收藏
页码：115 / 123
页数：9
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