Electrical Property of Conductive Adhesives Using Silver-coated Copper Filler

被引:5
|
作者
Nishikawa, Hiroshi [1 ]
Mikami, Saya [2 ]
Terada, Nobuto [3 ]
Miyake, Koich [4 ]
Aoki, Akira [5 ]
Takemoto, Tadashi [1 ]
机构
[1] Osaka Univ, Joining & Welding Res Inst, Suita, Osaka 565, Japan
[2] Osaka Univ, Grad Sch Engn, Osaka, Japan
[3] Harima Chemicals Inc, Tokyo, Japan
[4] MITSU MINING & SMELTING CO LTD, Tokyo, Japan
[5] Hikoshima Smelting Co Ltd, Yamaguchi, Japan
关键词
D O I
10.1109/ESTC.2008.4684458
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, isotropic conductive adhesives (ICAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, the silver was coated with copper filler, and the silver-coated copper was tested as a filler metal. As a result, it was found that the electrical resistance of ICA with silver-coated copper filler was clearly lower and more stable than that of ICA with copper filler after curing and after reliability tests.
引用
收藏
页码:825 / +
页数:2
相关论文
共 50 条
  • [1] Preparation and characterization of ultrafine silver-coated copper powder and electrical conductive adhesives
    Zhang, Xiao-Min
    Li, Qi-Long
    Du, Hai-Tao
    Wang, Bin
    [J]. Gao Xiao Hua Xue Gong Cheng Xue Bao/Journal of Chemical Engineering of Chinese Universities, 2020, 34 (04): : 1069 - 1075
  • [2] Comparative Performances of Electrically Conductive Adhesives by Incorporation of Silver, Silver-Coated Copper, and Graphene
    Sung, Kyung-Soo
    Kim, Namil
    [J]. POLYMER-KOREA, 2019, 43 (05) : 728 - 734
  • [3] Electrically conductive epoxy-based nanocomposite adhesives loaded with silver-coated copper and silver-coated reduced graphene oxide nanoparticles
    Peighambardoust, Seyed Jamaleddin
    Rikhtegar, Hamed
    Pakdel, Parisa Mohammadzadeh
    Mirmohseni, Abdoireza
    [J]. POLYMERS FOR ADVANCED TECHNOLOGIES, 2019, 30 (08) : 1996 - 2004
  • [4] Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging
    Zhang, Xiao Min
    Yang, Xiao-Li
    Wang, Bin
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2021, 105
  • [5] Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder
    Hamrah, Z. Sahebi
    Lashgari, V. A.
    Mohammadi, M. H. Doost
    Uner, D.
    Pourabdoli, M.
    [J]. MICROELECTRONICS RELIABILITY, 2021, 127
  • [6] Effect of time, temperature and composition on the performance of conductive adhesives made of silver-coated copper powder
    Hamrah, Z. Sahebi
    Pourabdoli, M.
    Lashgari, V. A.
    Mohammadi, M. H. Doost
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2022, 114
  • [7] Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
    Nishikawa, Hiroshi
    Mikami, Saya
    Miyake, Koichi
    Aoki, Akira
    Takemoto, Tadashi
    [J]. MATERIALS TRANSACTIONS, 2010, 51 (10) : 1785 - 1789
  • [8] The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold
    Zhang, Weiwei
    Liu, Jiahao
    Zhang, Luobin
    Wang, Jianqiang
    Zhang, Zheng
    Wang, Jintao
    Liu, Hao
    Chen, Hongtao
    Li, Mingyu
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2022, 114
  • [9] Controlling the conduction mechanisms in isotropic conductive adhesives with silver-coated polymer spheres
    Pettersen, Sigurd R.
    Zhang, Zhiliang
    He, Jianying
    Kristiansen, Helge
    Redford, Keith
    Helland, Susanne
    Kalland, Erik
    [J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2494 - 2500
  • [10] Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications
    Lin, YS
    Chiu, SS
    [J]. POLYMER ENGINEERING AND SCIENCE, 2004, 44 (11): : 2075 - 2082