Comparative Performances of Electrically Conductive Adhesives by Incorporation of Silver, Silver-Coated Copper, and Graphene

被引：1
|
作者：
Sung, Kyung-Soo [1 ]
Kim, Namil [2 ]
机构：
[1] Protav Korea, Res & Dev Ctr, Daejeon 34326, South Korea
[2] Korea Automot Technol Inst, Environm Mat R&D Ctr, Chungnam 31214, South Korea
来源：
POLYMER-KOREA | 2019年 / 43卷 / 05期
关键词：
electrically conductive adhesives; graphene; silver; silver-coated copper; electrical conductivity; adhesion strength; aging test; CARBON NANOTUBE; EPOXY-RESIN; FLAKES; NANOSHEETS;
D O I：
10.7317/pk.2019.43.5.728
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
The effect of conductive fillers on electrical and adhesion properties of electrically conductive adhesives (ECAs) has been investigated. The ECAs were prepared by incorporating different conductive fillers such as silver (Ag), silver-coated copper (AgCu), and graphene into epoxy binder. At constant filler concentration, the Ag-filled ECAs exhibited the lowest bulk resistivity at around 3.6x10(-4) Omega. cm as compared to the ECAs filled with Ag/AgCu and Ag/AgCu/ graphene. Adhesion strength between silicon die and metallic lead frame showed systematic drop upon addition of graphene. Under 85 degrees C and 85% humidity environment, the bulk resistivity of the Ag/AgCu and Ag/AgCu/graphenefilled ECAs decreased with aging time due to the increase of crosslink density while the Ag-filled ECAs remained stable. Adhesion strength decreased with aging time.
引用
收藏
页码：728 / 734
页数：7
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