Formation mechanism and reliability of Cu6Sn5 textures formed in-between liquid Sn and (111)/(001) Cu single crystals

被引：0
|
作者：
Yao, Shun [1 ]
Wang, Xuelin [2 ]
Yang, Shihua [2 ]
Zhang, Zhihao [1 ]
Cao, Huijun [3 ]
机构：
[1] Xiamen Univ, Coll Mat, Fujian Key Lab Adv Mat, Xiamen 361005, Peoples R China
[2] Shanghai Aerosp Equipment Mfg, Shanghai 200245, Peoples R China
[3] Xiamen City Univ, Sch Mech & Automat Engn, Xiamen 361005, Peoples R China
来源：
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年
关键词：
Cu single crystal; Cu6Sn5; formation mechanism reliability; SHEAR-STRENGTH; SOLDER JOINTS; PHASE; ORIENTATION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Formation mechanism and reliability of the CU6Sn5 textures formed in-between the liquid SnCu0.7 solder and (111) /(001) Cu single crystals were studied in this paper. Regular arrays of the roof-type CU6Sn5 grains with the fixed intersecting angles were generated on both types of Cu single crystals after soldering at 250 degrees C for 1 min. The formation mechanism of these CU6Sn5 roofs was confirmed to be a hexagonal-rod-type growth mode due to morphology and orientation analyses. In addition, based on the shear tests of the actual solder joints, the CU6Sn5 textures formed on (111)/(001) Cu single crystals were affirmed to be ideally suitable for use as the reliable interfacial connection layers to resist shear failures in electronic packaging.
引用
收藏
页码：444 / 447
页数：4
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