Design issues and insights for low-voltage high-density SOI DRAM

被引:9
|
作者
Fossum, JG [1 ]
Chiang, MH
Houston, TW
机构
[1] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA
[2] Texas Instruments Inc, Dallas, TX 75243 USA
关键词
circuit simulation; CMOS digital integrated circuits; integrated circuit design; silicon-on-insulator technology;
D O I
10.1109/16.669528
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A physics-based study of floating-body effects on the operation of SOI DRAM is described. The study, which is based on device and circuit simulations using a physical SOI MOSFET model calibrated to an actual partially-depleted (PD) SOI DRAM technology, addresses the performance of the peripheral circuitry, e.g., the sense amplifier, as well as the dynamic retention of the data storage cell. Design insight for low-voltage high-density SOI DRAM is attained. Doable cell design is shown to yield dynamic retention time long enough for gigabit memories, and crude body-source ties for nMOS, with pMOS bodies floating, are shown to effectively suppress instabilities in the sense amplifier.
引用
收藏
页码:1055 / 1062
页数:8
相关论文
共 50 条
  • [1] LATEST DRAM TECHNOLOGY FOR LOW-VOLTAGE, HIGH-DENSITY COMPUTING
    不详
    ELECTRONIC PRODUCT DESIGN, 1995, 16 (09): : S13 - S13
  • [2] An asymmetrically controlled sense amplifier with boosted sensing voltage difference for low-voltage and high-density DRAM
    Li, Xiaocui
    Du, Zhichao
    Wang, Yu
    Duan, Franklin Li
    MICROELECTRONIC ENGINEERING, 2023, 276
  • [3] Sensing Margin Enhancement Technique Utilizing Boosted Reference Voltage for Low-Voltage and High-Density DRAM
    Kim, Suk Min
    Song, Byungkyu
    Jung, Seong-Ook
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2019, 27 (10) : 2413 - 2422
  • [4] Analysis of the NAND-type DRAM-on-SGT for high-density and low-voltage memory.
    Nakamura, H
    Pesic, I
    Sakuraba, H
    Masuoka, F
    PROCEEDINGS OF ESSDERC 2005: 35TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2005, : 193 - 196
  • [5] High-Yield Design of High-Density SRAM for Low-Voltage and Low-Leakage Operations
    Dhori, Kedar Janardan
    Chawla, Hitesh
    Kumar, Ashish
    Pandey, Pashant
    Kumar, Promod
    Ciampolini, Lorenzo
    Cacho, Florian
    Croain, Damien
    2017 IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT TOLERANCE IN VLSI AND NANOTECHNOLOGY SYSTEMS (DFT), 2017, : 7 - 12
  • [6] A NEW HIGH-DENSITY LOW-VOLTAGE SSIMOS EEPROM CELL
    IPRI, AC
    STEWART, RG
    FARAONE, L
    CARTWRIGHT, JM
    SCHLESIER, KM
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (04) : 758 - 765
  • [7] Features of SOI DRAM's and their potential for low-voltage and/or giga-bit scale DRAM's
    Yamaguchi, Y
    Oashi, T
    Eimori, T
    Iwamatsu, T
    Miyamoto, S
    Suma, K
    Tsuruda, T
    Morishita, F
    Hirose, M
    Hidaka, H
    Arimoto, K
    Fujishima, K
    Inoue, Y
    Nishimura, T
    Miyoshi, H
    IEICE TRANSACTIONS ON ELECTRONICS, 1996, E79C (06): : 772 - 780
  • [8] Characterization of Low-Voltage Areas in Patients With Atrial Fibrillation: Insights From High-Density Intracardiac Mapping
    Nery, Pablo B.
    Al Dawood, Wafa
    Nair, Girish M.
    Redpath, Calum J.
    Sadek, Mouhannad M.
    Chen, Li
    Green, Martin S.
    Wells, George
    Birnie, David H.
    CANADIAN JOURNAL OF CARDIOLOGY, 2018, 34 (08) : 1033 - 1040
  • [9] Low-voltage and high-speed operation for high-density SRAMs by BBC cell
    Maki, Y
    Honda, H
    Morimoto, R
    Sato, H
    Nagaoka, H
    Wada, T
    Arita, Y
    Tsutsumi, K
    Miyoshi, H
    INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, : 859 - 862
  • [10] A hierarchical sensing scheme (HSS) of high-density and low-voltage operation SRAMs
    Haraguchi, Y
    Wada, T
    Arita, Y
    1997 SYMPOSIUM ON VLSI CIRCUITS: DIGEST OF TECHNICAL PAPERS, 1997, : 79 - 80