Flip chip package failure mechanisms

被引：0

作者：

Semmens, JE ^{[1
]}

Adams, T ^{[1
]}

机构：

[1] Sonoscan Inc, Bensenville, IL USA

来源：

SOLID STATE TECHNOLOGY | 1998年 / 41卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Completely assembled flip chip packages are notoriously difficult to inspect for critical defects. Acoustic micro imaging tools with sophisticated electronic subsystems can identify the major types of hidden internal defects. Failure mechanisms can thus be determined and remedied.

引用

页码：59 / +

页数：5

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