Thermo-mechanical analysis of metal backed circuit boards

被引：0
|
作者：
Johnson, RW [1 ]
Knight, RW [1 ]
Suhling, JC [1 ]
机构：
[1] AUBURN UNIV,LEACH CTR 231,CTR COMMERCIAL DEV,AUBURN,AL 36849
来源：
SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM (STAIF-96), PTS 1-3: 1ST CONFERENCE ON COMMERCIAL DEVELOPMENT OF SPACE; 1ST CONFERENCE ON NEXT GENERATION LAUNCH SYSTEMS; 2ND SPACECRAFT THERMAL CONTROL SYMPOSIUM; 13TH SYMPOSIUM ON SPACE NUCLEAR POWER AND PROPULSION - FUTURE SPACE AND EARTH SCIENCE MISSIONS - SPECIAL TOPIC; REMOTE SENSING FOR COMMERCIAL, CIVIL AND SCIENCE APPLICATIONS - SPECIAL TOPIC | 1996年 / 361期
关键词：
D O I：
暂无
中图分类号：
V [航空、航天];
学科分类号：
08 ; 0825 ;
摘要：
引用
收藏
页码：245 / 250
页数：6
相关论文
共 50 条
  • [41] Thermo-mechanical analysis of dental silicone polymers
    M. -H. Lacoste-Ferré
    Ph. Demont
    J. Dandurand
    E. Dantras
    M. Blandin
    C. Lacabanne
    Journal of Materials Science, 2006, 41 : 7611 - 7616
  • [42] Thermo-mechanical analysis on a compact thermoelectric cooler
    Gong, Tingrui
    Wu, Yongjia
    Gao, Lei
    Zhang, Long
    Li, Juntao
    Ming, Tingzhen
    ENERGY, 2019, 172 : 1211 - 1224
  • [43] Reliability of BGA and CSP on metal-backed printed circuit boards in harsh environments
    Lall, Pradeep
    Islam, Nokibul
    Evans, John
    Suhling, Jeff
    JOURNAL OF ELECTRONIC PACKAGING, 2007, 129 (04) : 382 - 390
  • [44] Thermo-Mechanical Calculation of Printed Circuit Heat Exchanger Using Homogenization
    GARNIER Christophe
    VINCENT Sébastien
    LAMAGNERE Pierre
    LEJEAIL Yves
    CACHON Lionel
    Journal of Thermal Science, 2022, 31 (06) : 2309 - 2328
  • [45] Thermo-Mechanical Calculation of Printed Circuit Heat Exchanger Using Homogenization
    Garnier, Christophe
    Vincent, Sebastien
    Lamagnere, Pierre
    Lejeail, Yves
    Cachon, Lionel
    JOURNAL OF THERMAL SCIENCE, 2022, 31 (06) : 2309 - 2328
  • [46] Effect of Short Circuit Currents on Thermo-mechanical Properties of Insulated Cables
    Hamdan, M. A.
    Pilgrim, J. A.
    Lewin, P. L.
    2018 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (IEEE CEIDP), 2018, : 414 - 417
  • [47] Thermo-Mechanical Calculation of Printed Circuit Heat Exchanger Using Homogenization
    Christophe Garnier
    Sébastien Vincent
    Pierre Lamagnere
    Yves Lejeail
    Lionel Cachon
    Journal of Thermal Science, 2022, 31 : 2309 - 2328
  • [48] An automatic thermo-mechanical testing apparatus for metal forming applications
    Agirre, Julen
    Abedul, David
    de Argandon, Eneko Saenz
    Otegi, Nagore
    Galdos, Lander
    Erice, Borja
    INTERNATIONAL JOURNAL OF IMPACT ENGINEERING, 2023, 182
  • [49] Thermo-mechanical modeling of metal cutting using MARC Mentat
    Pavel, R
    Srivastava, A
    TRANSACTIONS OF THE NORTH AMERICAN MANUFACTURING RESEARCH INSTITUTION OF SME 2005, VOL 33, 2005, 2005, 33 : 581 - 588
  • [50] Thermo-mechanical relaxation of stresses in a glass-metal junction
    Lyubimova, O. N.
    Solonenko, E. P.
    ALL RUSSIAN CONFERENCE WITH THE SCHOOL FOR YOUNG SCIENTISTS THERMOPHYSICS AND PHYSICAL HYDRODYNAMICS - 2016, 2016, 754 (1-10):
12345