Thermo-mechanical analysis of metal backed circuit boards

被引：0
|
作者：
Johnson, RW [1 ]
Knight, RW [1 ]
Suhling, JC [1 ]
机构：
[1] AUBURN UNIV,LEACH CTR 231,CTR COMMERCIAL DEV,AUBURN,AL 36849
来源：
SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM (STAIF-96), PTS 1-3: 1ST CONFERENCE ON COMMERCIAL DEVELOPMENT OF SPACE; 1ST CONFERENCE ON NEXT GENERATION LAUNCH SYSTEMS; 2ND SPACECRAFT THERMAL CONTROL SYMPOSIUM; 13TH SYMPOSIUM ON SPACE NUCLEAR POWER AND PROPULSION - FUTURE SPACE AND EARTH SCIENCE MISSIONS - SPECIAL TOPIC; REMOTE SENSING FOR COMMERCIAL, CIVIL AND SCIENCE APPLICATIONS - SPECIAL TOPIC | 1996年 / 361期
关键词：
D O I：
暂无
中图分类号：
V [航空、航天];
学科分类号：
08 ; 0825 ;
摘要：
引用
收藏
页码：245 / 250
页数：6
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