Reliability of low-cost PCB interconnections for telecommunication applications

被引：1
|
作者：
Duchamp, G [1 ]
Verdier, F [1 ]
Deshayes, Y [1 ]
Marc, F [1 ]
Ousten, Y [1 ]
Danto, Y [1 ]
机构：
[1] CNRS, UMR 5818, Lab IXL, ENSEIRB, F-33405 Talence, France
来源：
MICROELECTRONICS RELIABILITY | 2004年 / 44卷 / 9-11期
关键词：
D O I：
10.1016/j.microrel.2004.07.013
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Today the low cost PCB interconnections are widely used for domestic telecommunication applications. These technologies are limited by the possible variation of the performances of substrates and metallization during operating life. The knowledge of the behaviour of these parameters under stress conditions allows to optimise the design safety margins and to predict a probable lifetime. In this paper we show that the proposed structures (rings and stub resonators) could be used to discriminate the degradation sources. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1299 / 1304
页数：6
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