Deformation mechanisms and constitutive modeling for silicon nitride undergoing laser-assisted machining

被引：84
|
作者：
Lei, ST [1 ]
Shin, YC [1 ]
Incropera, FP [1 ]
机构：
[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
来源：
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE | 2000年 / 40卷 / 15期
基金：
美国国家科学基金会;
关键词：
ceramic machining; laser-assisted machining; constitutive modeling; silicon-nitride;
D O I：
10.1016/S0890-6955(00)00051-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Material deformation behavior has been studied for silicon nitride containing 10 wt% of YSiAlON glass under laser-assisted machining (LAM). Material removal mechanisms were inferred from scanning electron microscopy observations of the chips, and the shear zone stress was determined using three-dimensional machining theory with a new approach to determining shear angles for segmented chips formed in LAM. The effects of operating conditions on the shear zone stress were determined from an experimental parametric study, and the results were used to develop a constitutive equation for the deformation process. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：2213 / 2233
页数：21
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