Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module

被引：0

作者：

Lee, K-W ^{[1
]}

Kanno, S. ^{[1
]}

Ohara, Y. ^{[1
]}

Kiyoyama, K. ^{[1
]}

Bea, J-C ^{[1
]}

Fukushima, T. ^{[1
]}

Tanaka, T. ^{[2
]}

Koyanagi, M. ^{[1
]}

机构：

[1] Tohoku Univ, Dept Bioengn & Robot, Sendai, Miyagi 9808579, Japan

[2] Tohoku Univ, Grad Sch Biomed Engn, Dept Biomed Engn, Sendai, Miyagi 980, Japan

来源：

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION | 2009年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

We developed novel interconnection technology for heterogeneous integration of MEMS and LSI mufti-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertically stacked each others. The cavity chip composed of deep Cu TSV-beam lead wires was developed for interconnecting MEMS chips with high step height of more than 100um. Fundamental characteristics were successfully obtained from pressure sensing MEMS chip with 360 mu m thickness, which was connected to the substrate by the cavity chip. MEMS and LSI chips were vertically integrated by using the cavity chip without changes of chip design and extra processes. This interconnection technology can give strong solution for heterogeneous integration of MEMS and LSI chips multi-chip module.

引用

页码：6 / +

页数：3

共 50 条

[21] Multi-Chip Module (MCM-D) Using Thin Film Technology
Adamo, Cristina B.
Flacker, Alexander
Freitas, Wilson
Teixeira, Ricardo C.
da Silva, Michele O.
Rotondaro, Antonio L. P.
2014 29TH SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES (SBMICRO), 2014,
[22] Interconnect and sensitivity analysis of multi-chip module
Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, 32 (04): : 80 - 84
[23] The study of thermal controlling technology for three-dimension multi-chip module
Cao, YS
Shi, FZ
Liu, J
CONCURRENT ENGINEERING: THE WORLDWIDE ENGINEERING GRID, PROCEEDINGS, 2004, : 805 - 808
[24] Field programmable multi-chip module (FPMCM)
Darnauer, Joel
Garay, Porfirio
Isshiki, Tsuyoshi
Ramirez, John
Dai, Wayne Wei-Ming
1994, : 1 - 10
[25] MULTI-CHIP MODULE TEST AND DIAGNOSTIC METHODOLOGY
CURTIN, JJ
WAICUKAUSKI, JA
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1983, 27 (01) : 27 - 34
[26] PLC Multi-Chip Integration Technologies
Motohaya Ishii
光学学报, 2003, (S1) : 199 - 200
[27] CLAy field configurable multi-chip module
Nguyen, LT
Garverick, T
Field, C
1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS, 1996, 2794 : 183 - 186
[28] 2.5D MCM (Multi-chip Module) Technology Development for Advanced Package
Yip, Laurene
Tsai, James
Lin, Rosa
Hsu, Ian
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 778 - 782
[29] Embedded Ceramic Interconnect Bridge in Organic Substrate for Heterogeneous Integration and Multi-Chip Packaging
Wu, Boping
2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2017,
[30] Process synthesis and design for multi-chip module fabrication
Pierce, DW
Realff, MJ
COMPUTERS & CHEMICAL ENGINEERING, 1996, 20 : S1307 - S1315

← 1 2 3 4 5 →