The future of microelectronics and photonics and the role of mechanics and materials

被引：14

|

作者：

Suhir, E

机构：

来源：

JOURNAL OF ELECTRONIC PACKAGING | 1998年 / 120卷 / 01期

关键词：

D O I：

10.1115/1.2792280

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

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页码：1 / 11

页数：11

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