The future of microelectronics and photonics and the role of mechanics and materials

被引：14
|
作者：
Suhir, E
机构：
来源：
JOURNAL OF ELECTRONIC PACKAGING | 1998年 / 120卷 / 01期
关键词：
D O I：
10.1115/1.2792280
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：1 / 11
页数：11
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