Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding

被引：0

作者：

Quellmalz, Arne ^{[1
]}

Sawallich, Simon ^{[2
,3
]}

Prechtl, Maximilian ^{[4
]}

Hartwig, Oliver ^{[4
]}

Luo, Siwei ^{[4
]}

Wagner, Stefan ^{[5
]}

Duesberg, Georg S. ^{[4
]}

Lemme, Max C. ^{[5
]}

Niklaus, Frank ^{[1
]}

Gylfason, Kristinn B. ^{[1
]}

机构：

[1] KTH Royal Inst Technol, Micro & Nanosyst, Malvinas Vag 10, S-10044 Stockholm, Sweden

[2] Protemics GmbH, Otto Blumenthal Str 25, D-52074 Aachen, Germany

[3] Rhein Westfal TH Aachen, Chair Elect Devices, Otto Blumenthal Str 2, D-52074 Aachen, Germany

[4] Univ Bundeswehr Munchen, Inst Phys, Werner Heisenberg Weg 39, D-85577 Neubiberg, Germany

[5] AMO GmbH, Adv Microelect Ctr Aachen AMICA, Otto Blumenthal Str 25, D-52074 Aachen, Germany

来源：

2021 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) | 2021年

基金：

瑞典研究理事会; 欧盟地平线“2020”;

关键词：

PHOTONICS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS2). (C) 2021 The Author(s)

引用

页数：2

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