Modelling and uncertainty analysis of Seebeck coefficient measurements by using the finite element method

被引：1
|
作者：
Huang, K. [1 ]
Edler, F. [1 ]
Haupt, S. [1 ]
Ziolkowski, P. [2 ]
Stiewe, C. [2 ]
Mueller, E. [2 ,3 ]
机构：
[1] Phys Tech Bundesanstalt, Abbestr 2-12, D-10587 Berlin, Germany
[2] German Aerosp Ctr, Inst Mat Res, D-51147 Cologne, Germany
[3] Justus Liebig Univ Giessen, Inst Inorgan & Analyt Chem, Heinrich Buff Ring 17, D-35392 Giessen, Germany
来源：
MATERIALS TODAY-PROCEEDINGS | 2021年 / 44卷
关键词：
Seebeck coefficient; Finite element method; Measurement uncertainty; Transient thermovoltage; Finger effect;
D O I：
10.1016/j.matpr.2020.09.158
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The present work is focused on the determination of single uncertainty contributions of Seebeck coefficient measurements of semiconducting bulk materials. Different simulations are performed to quantitatively explore effects and their influence on the measurement uncertainty. The following effects are studied by the finite element method (FEM): the choice of data sets from transient thermoelectric signals, the influence of asynchronous voltage and temperature measurements, and the so called "finger" effect, which represents the falsification of a measurement caused by the contact resistance between a sensor and a sample. The FEM allows the exploration of the data space under ideal conditions, which are hardly obtainable in real experiments. The results of the simulations are used to quantify the corresponding uncertainty contributions. (c) 2019 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the 17th European Thermoelectric Conference.
引用
收藏
页码：3500 / 3505
页数：6
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