Investigating Copper Wire Bonding Technology in Chip-on-Board Applications

被引：0
|
作者：
Krammer, Oliver [1 ]
Roka, Peter [1 ]
Jakab, Laszlo [1 ]
机构：
[1] Budapest Univ Technol & Econ, Dept Elect Technol, Budapest, Hungary
来源：
2013 PROCEEDINGS OF THE 36TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In our experiment, the possibility of forming copper wire bonds in Chip-on-Board (COB) applications was investigated. In the experiment, such surface finishes were studied and compared which are common in printed circuit board based COB applications and can be bonded with wire bonding technologies. These finishes were immersion silver (ImAg), electroless nickel / immersion gold (ENIG) and electroless nickel / electroless palladium / immersion gold (ENEPIG). On each type of surface finish, copper wires with two diameters (33 and 300 mu m) were bonded with a TPT Ultrasonic bonder. The wire bonds then characterized by optical inspections and mechanical measurements which are detailed in the paper.
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页码：94 / 98
页数：5
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