Next Generation Computing Systems with Heterogeneous Packaging Integration

被引：0
|
作者：
Knickerbocker, John U. [1 ]
机构：
[1] IBM TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源：
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
IBM Research and Micro-System Technology and Solutions Team are enabling next generation computing systems with heterogeneous packaging integration that support both large size / high performance systems and also support miniaturized / low power mobile wireless systems / sensors.
引用
收藏
页码：45 / 45
页数：1
相关论文
共 50 条
  • [41] Soft computing approaches for next-generation sustainable systems (SCNGS)
    Pasumpon Pandian
    Xavier Fernando
    Tomonobu Senjyu
    Soft Computing, 2019, 23 : 2483 - 2483
  • [42] Edge Computing Architectures for Enabling the Realisation of the Next Generation Robotic Systems
    Seisa, Achilleas Santi
    Damigos, Gerasimos
    Satpute, Sumeet Gajanan
    Koval, Anton
    Nikolakopoulos, George
    2022 30TH MEDITERRANEAN CONFERENCE ON CONTROL AND AUTOMATION (MED), 2022, : 487 - 493
  • [43] System level tools and reconfigurable computing for next generation HWIL systems
    Stark, D
    McAulay, D
    Cantle, AJ
    Devlin, M
    TECHNOLOGIES FOR SYNTHETIC ENVIRONMENTS: HARDWARE-IN-THE-LOOP TESTING VI, 2001, 4366 : 383 - 394
  • [44] Soft computing approaches for next-generation sustainable systems (SCNGS)
    Pandian, Pasumpon
    Fernando, Xavier
    Senjyu, Tomonobu
    SOFT COMPUTING, 2019, 23 (08) : 2483 - 2483
  • [45] Hetero-DB: Next Generation High-Performance Database Systems by Best Utilizing Heterogeneous Computing and Storage Resources
    Kai Zhang
    Feng Chen
    Xiaoning Ding
    Yin Huai
    Rubao Lee
    Tian Luo
    Kaibo Wang
    Yuan Yuan
    Xiaodong Zhang
    Journal of Computer Science and Technology, 2015, 30 : 657 - 678
  • [46] Hetero-DB: Next Generation High-Performance Database Systems by Best Utilizing Heterogeneous Computing and Storage Resources
    Zhang, Kai
    Chen, Feng
    Ding, Xiaoning
    Huai, Yin
    Lee, Rubao
    Luo, Tian
    Wang, Kaibo
    Yuan, Yuan
    Zhang, Xiaodong
    JOURNAL OF COMPUTER SCIENCE AND TECHNOLOGY, 2015, 30 (04) : 657 - 678
  • [47] Impact of technology overlap in next-generation wireless heterogeneous systems
    Zahran, Ahmed
    Liang, Ben
    Saleh, Aladdin
    NETWORKING 2007: AD HOC AND SENSOR NETWORKS, WIRELESS NETWORKS, NEXT GENERATION INTERNET, PROCEEDINGS, 2007, 4479 : 535 - +
  • [48] Integration of Ferroelectric Materials: An Ultimate Solution for Next-Generation Computing and Storage Devices
    Khosla, Robin
    Sharma, Satinder K.
    ACS APPLIED ELECTRONIC MATERIALS, 2021, 3 (07) : 2862 - 2897
  • [49] Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process
    Elsherbini, A.
    Jun, K.
    Liff, S.
    Talukdar, T.
    Bielefeld, J.
    Li, W.
    Vreeland, R.
    Niazi, H.
    Rawlings, B.
    Ajayi, T.
    Tsunoda, N.
    Hoff, T.
    Woods, C.
    Pasdast, G.
    Tiagaraj, S.
    Kabir, E.
    Shi, Y.
    Brezinski, W.
    Jordan, R.
    Ng, J.
    Brun, X.
    Krisnatreya, B.
    Liu, P.
    Zhang, B.
    Qian, Z.
    Goel, M.
    Swan, J.
    Yin, G.
    Pelto, C.
    Torres, J.
    Fischer, P.
    2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM, 2022,
  • [50] Heterogeneous Packaging Technologies for Chiplet and Memory Integration
    Li, Yan
    Kim, WooPoung
    Advancing Microelectronics, 2024, 51 (01): : 12 - 16
12345