Next Generation Computing Systems with Heterogeneous Packaging Integration

被引：0
|
作者：
Knickerbocker, John U. [1 ]
机构：
[1] IBM TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源：
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
IBM Research and Micro-System Technology and Solutions Team are enabling next generation computing systems with heterogeneous packaging integration that support both large size / high performance systems and also support miniaturized / low power mobile wireless systems / sensors.
引用
收藏
页码：45 / 45
页数：1
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