The influence of thermal conductivity on segmented chip formation

被引：34
|
作者：
Bäker, M [1 ]
Rösler, J [1 ]
Siemers, C [1 ]
机构：
[1] Tech Univ Braunschweig, Inst Werkstoffe, D-38106 Braunschweig, Germany
来源：
COMPUTATIONAL MATERIALS SCIENCE | 2003年 / 26卷
关键词：
machining; segmented chips; thermal conductivity; finite elements; remeshing;
D O I：
10.1016/S0927-0256(02)00396-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A two-dimensional finite element model of the machining process is presented. After a short discussion of the modelling technique and the remeshing algorithm used, the influence of thermal conductivity on the chip segmentation process is studied. Increasing thermal conductivity leads to a decreasing degree of segmentation and to an increase in the cutting force. The influence of the thermal conductivity on the width of the shear bands and on maximum temperatures is also discussed. (C) 2002 Elsevier Science B.V. All right reserved.
引用
收藏
页码：175 / 182
页数：8
相关论文
共 50 条
  • [41] Influence of thermal treatment on the conductivity of PEDT films
    Li, J
    Fan, LH
    Wong, CP
    9TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2004 PROCEEDINGS, 2004, : 204 - 207
  • [42] Influence of an electric field on the thermal conductivity of a solid
    Groetzinger, G
    NATURE, 1935, 135 : 1001 - 1001
  • [43] Influence of the Composition of α-Titanium Alloys on Thermal Conductivity
    I. A. Schastlivaya
    V. P. Leonov
    I. V. Tret’yakov
    A. Yu. Askinazi
    Inorganic Materials: Applied Research, 2021, 12 : 1494 - 1498
  • [44] Study on the influence of temperature on the thermal conductivity of granite
    Gui, Ren
    Li, Jianzhong
    Hu, Tianyang
    Zhang, Yuxing
    Shu, Biao
    Journal of Railway Science and Engineering, 2020, 17 (08) : 1986 - 1992
  • [45] The influence of complex pore shapes on thermal conductivity
    Bakker, K
    Konings, RJM
    NUCLEAR TECHNOLOGY, 1996, 115 (01) : 91 - 99
  • [46] INFLUENCE OF CLUSTERS ON THERMAL-CONDUCTIVITY OF GAAS
    VUILLERMOZ, PL
    LAUGIER, A
    PINARD, P
    PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, 1974, 63 (01): : 271 - 278
  • [47] Influence of Controlled Aggregation on Thermal Conductivity of Nanofluids
    Azizian, Reza
    Doroodchi, Elham
    Moghtaderi, Behdad
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2016, 138 (02):
  • [48] An improvement of thermal conductivity of underfill materials for flip-chip packages
    Li, HY
    Jacob, KI
    Wong, CP
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (01): : 25 - 32
  • [49] An improvement of thermal conductivity of underfill materials for flip-chip packages
    Li, H., 1600, Institute of Electrical and Electronics Engineers Inc. (26):
  • [50] Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications
    Yim, MJ
    Kim, HJ
    Paik, KW
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (08) : 1165 - 1171
12345