An improvement of thermal conductivity of underfill materials for flip-chip packages

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作者：
机构：
[1] Li, Haiying
[2] Jacob, Karl I.
[3] Wong, C.P.
来源：
Li, H. | 1600年 / Institute of Electrical and Electronics Engineers Inc.卷 / 26期
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All Open Access; Green;
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摘要：
Flip chip devices
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