Development of Electromagnetic Analytical Models for Substrate Noise Propagation in Integrated Circuits

被引：0

作者：

Novellas, Merce Grau ^{[1
]}

Serra, Ramiro ^{[1
]}

Rose, Matthias ^{[2
]}

机构：

[1] Eindhoven Univ Technol, Dept Elect Engn, POB 513, NL-5600 MB Eindhoven, Netherlands

[2] NXP Semicond, High Tech Campus 46, Eindhoven, Netherlands

来源：

2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC) | 2015年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.

引用

页码：582 / 587

页数：6

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