Reliability investigations of different bumping processes for flip chip and TAB applications

被引：0
|
作者：
Jung, E [1 ]
Kloeser, J [1 ]
Nave, J [1 ]
Engelmann, G [1 ]
Dietrich, L [1 ]
Zakel, E [1 ]
Reichl, H [1 ]
机构：
[1] FRAUNHOFER INST ZUVERLASSIGKEIT & MIKROINTEGRAT,D-13355 BERLIN,GERMANY
来源：
NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM | 1996年
关键词：
D O I：
10.1109/IEMT.1996.559743
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：274 / 281
页数：8
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