Ball bumping and coining operations for tab and flip chip

被引：1
|
作者：
Levine, L
机构：
来源：
3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS | 1997年
关键词：
D O I：
10.1109/ISAPM.1997.581269
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The process of using a ball bonder to form bumps on a chip, for subsequent TAB or Flip Chip attachment to a substrate, has now reached the production stage. A number of companies are using the process for full scale production. Other companies are using the process for rapid prototyping and limited quantity production, It requires no masks, uses existing equipment, and in many cases provides the most cost effective method for depositing bumps on chips. Two process variations are prevalent.
引用
收藏
页码：110 / 112
页数：3
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