Advanced Integrated Circuit Three Dimensional Stacked Package and its Key Technology

The 3D (three dimensional) stacked package technology is developing trend of the integrated circuit advanced packaging, which can easily meet the developing of smaller footprint, lower profile, multifunction, lower power consumption and lower cost for the cell phones and consumer products like digital cameras, MP4, PDA and other wireless devices. Some correlative concepts of the 3D stacked package have been presented in this paper. Firstly, it mainly analyzes the classifications and the key technologies of the 3D stacked package. Furthermore, it briefly states the problems that the 3D stacked package technology must be faced, and the applications are also discussed in the end.