Design for reliability with the advanced integrated circuit (IC) technology: challenges and opportunities

被引：27
|
作者：
Ji, Zhigang [1 ]
Chen, Haibao [1 ]
Li, Xiuyan [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Microelect, Shanghai 200240, Peoples R China
来源：
SCIENCE CHINA-INFORMATION SCIENCES | 2019年 / 62卷 / 12期
基金：
中国国家自然科学基金;
关键词：
D O I：
10.1007/s11432-019-2643-5
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
[No abstract available]
引用
收藏
页数：4
相关论文
共 50 条
  • [1] Design for reliability with the advanced integrated circuit(IC) technology: challenges and opportunities
    Zhigang JI
    Haibao CHEN
    Xiuyan LI
    [J]. Science China(Information Sciences), 2019, 62 (12) : 242 - 245
  • [2] Design for reliability with the advanced integrated circuit (IC) technology: challenges and opportunities
    Zhigang Ji
    Haibao Chen
    Xiuyan Li
    [J]. Science China Information Sciences, 2019, 62
  • [3] IC Design Challenges and Opportunities for Advanced Process Technology
    Lee, Hsien-Hsin S.
    [J]. 2015 International symposium on VLSI Design, Automation and Test (VLSI-DAT), 2015,
  • [4] Advanced IC technology - Opportunities and challenges
    Anis, Mohab
    [J]. PROCEEDINGS OF 2008 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-10, 2008, : 776 - 779
  • [5] The multilayer ceramic integrated circuit (MCIC) technology: Opportunities and challenges
    Wilcox, DL
    Huang, RF
    Anderson, D
    [J]. 1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 17 - 23
  • [6] Challenges and Opportunities in Analog and Mixed Signal (AMS) Integrated Circuit (IC) Security
    Md Mahbub Alam
    Sreeja Chowdhury
    Beomsoo Park
    David Munzer
    Nima Maghari
    Mark Tehranipoor
    Domenic Forte
    [J]. Journal of Hardware and Systems Security, 2018, 2 (1) : 15 - 32
  • [7] IC interconnect technology - Challenges and opportunities
    Zhao, B
    [J]. SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, 2001, : 337 - 342
  • [8] TECHNOLOGY SCALING AND RELIABILITY: CHALLENGES AND OPPORTUNITIES
    Huard, V.
    Cacho, F.
    Federspiel, X.
    Arfaoui, W.
    Saliva, M.
    Angot, D.
    [J]. 2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2015,
  • [9] New Challenges of Design for Reliability in Advanced Technology Node (invited)
    Liu, Changze
    Sun, Yongsheng
    Ren, Pengpeng
    Gao, Dan
    Luo, Weichun
    Chen, Zanfeng
    Xia, Yu
    [J]. 2020 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2020), 2020,
  • [10] Design-For-Safety For Automotive IC Design: Challenges And Opportunities
    Nardi, Alessandra
    Camdzic, Samir
    Armato, Antonino
    Lertora, Francesco
    [J]. 2019 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2019,
12345