SIMULATION MODEL TO CONTROL RISK LEVELS ON PROCESS EQUIPMENT THROUGH METROLOGY IN SEMICONDUCTOR MANUFACTURING

被引：0

作者：

Sendon, Alejandro ^{[1
]}

Dauzere-Peres, Stephane ^{[1
]}

Pinaton, Jacques ^{[2
]}

机构：

[1] Ecole Mines St Etienne, Dept Mfg Sci & Logist, CMP, CNRS,UMR 6158,LIMOS, Site Georges Charpak,880 Ave Mimet, F-13541 Gardanne, France

[2] STMicroelect Rousset, ZI Rousset, F-13106 Rousset, France

来源：

2015 WINTER SIMULATION CONFERENCE (WSC) | 2015年

关键词：

D O I：

暂无

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

This paper first presents a simulation model implemented to study a specific workcenter in semiconductor manufacturing facilities (fabs) with the objective of controlling the risk on process equipment. The different components of the model, its inputs and its outputs, that led us to propose improvements in the workcenter, are explained. The risk evaluated in this study is the exposure level in the number of wafers on a process tool since the latest control performed for this tool, based on an indicator called Wafer at Risk (W@R). Our analysis shows that measures should be better managed to avoid lack of control and that an appropriate qualification strategy is required.

引用

页码：2941 / 2952

页数：12

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