Wafer-level packaging boosts yields of chip-on-board image sensors

被引：0
|
作者：
Humpston, Giles
Dagan, Yehudit
机构：
[1] Tessera, Met Technol, San Jose, CA 95134 USA
[2] Tessera Israel Ltd, Mkt, Jerusalem, Israel
来源：
SOLID STATE TECHNOLOGY | 2006年 / 49卷 / 11期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Chip-on-board (COB) is the most dominant assembly process used to build over a million camera modules each day of the year. These camera modules are used in camera phones, optical mice, and many other optical devices. However, as the market moves to cameras with ever-higher pixel counts, COB assembly becomes increasingly difficult due to contamination of the optical sensor. An effective way to prevent contamination is to place a cover over the image sensor at the wafer level, and leaving the bond pads exposed allows for full compatibility with the COB assembly process.
引用
收藏
页码：30 / 31
页数：2
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