共 50 条
- [21] THERMAL RELIABILITY OF LOW-COST HIGH-POWER LED PACKAGE MODULE UNDER WHTOL TEST IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 921 - 927
- [22] Thermal Management of Power LED System 2014 INTERNATIONAL CONFERENCE ON RENEWABLE ENERGY RESEARCH AND APPLICATION (ICRERA), 2014, : 760 - 764
- [23] High power LED and thermal management UV SOLID-STATE LIGHT EMITTERS AND DETECTORS, 2004, 144 : 253 - 260
- [24] Bump thermal management analysis of LED with Flipchip package ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 554 - +
- [25] Thermal Simulation of Bionic transpiration heat pipe system for high-power LED PROCEEDINGS OF THE 2014 16TH INTERNATIONAL CONFERENCE ON MECHATRONICS (MECHATRONIKA 2014), 2014, : 688 - 692
- [26] Thermal management for high-power applications Electronic Packaging and Production, 2000, 40 (10):
- [28] Thermal Performance of High Power LED Package Based on LTCC 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 441 - 444
- [29] Thermal a Modeling, Analysis, and Management of High-Power GaN Transistors 2013 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2013, : 241 - 244
- [30] Experimental and Numerical Study on Thermal Characteristics of High-power LED Street Lamp THERMAL, POWER AND ELECTRICAL ENGINEERING, PTS 1 AND 2, 2013, 732-733 : 161 - 164