Board level reliability assessment of chip scale packages

A large program had been initiated to study the board level reliability of various types of chip scale package (CSP). The results on six different packages are reported here, which cover flex interposer CSP, rigid interposer CSP, wafer level assembly CSP, and lead frame CSP. The packages were assembled on FR4 PCBs of two different thicknesses. Temperature cycling tests from -40 degrees C to +125 degrees C with 15 min dwell time at the extremes were conducted to failure for all the package types. The failure criteria were established based on the pattern of electrical resistance change, The cycles to failure were analyzed using Weibull distribution function for each type of package. Selected packages were tested in the temperature/humidity chamber under 85 degrees C/85%RH for 1000 h. Some assembled packages were tested in vibration condition as well. In all these tests, the electrical resistance of each package under testing was monitored continuously. Test samples were also cross-sectioned and analyzed under a Scanning Electronic Microscope (SEM). Different failure mechanisms were identified for various packages. It was noted that some packages failed at the solder joints while others failed inside the package, which was packaging design and process related. (C) 1998 IMAPS.