Power supply noise simulation considering dynamic effect of on-chip current

被引：0

作者：

Zhou, Yaping ^{[1
]}

Dhong, Sang H. ^{[1
]}

Nishino, Yoichi ^{[2
]}

Harvey, Paul M. ^{[1
]}

Mandrekar, Rohan ^{[1
]}

Gervais, Gilles ^{[1
]}

Criscolo, Nikki ^{[1
]}

机构：

[1] IBM Corp, 11501 Burnet Rd, Austin, TX 78758 USA

[2] Sony Comp Entertainment Amer, Austin, TX 78758 USA

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes a technique to analyze the dependence of on-chip switching current on power supply voltage and temperature, and how to implement that in power supply noise simulations. It is shown that this on-chip dynamic effect can introduce significant damping to the otherwise passive chip/package/board power supply network.

引用

页码：87 / +

页数：3

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