HfO2 dielectric thickness dependence of electrical properties in graphene field effect transistors with double conductance minima

We investigate the electrical properties in back-gated graphene field effect transistors (GFETs) with SiO2 dielectric and different thickness of high-k HfO2 dielectric. The results show that transform characteristic (I-ds-V-gs) curves of GFETs are uniquely W-shaped with two charge neutrality point (left and right) in both SiO2 and HfO2 dielectric (SiO2-GFETs and HfO2-GFETs). The gate voltage reduces drastically in HfO2-GFETs compared with that in SiO2-GFETs, and it becomes much smaller with the decline of HfO2 thickness. The left charge neutrality point in I-d-V-g curves of all HfO2-GFETs is negative, compared to the positive ones in SiO2-GFETs, which means that there exists n-doping in graphene with HfO2 as bottom dielectric. We speculate that this n-doping comes from the HfO2 layer, which brings fixed charged impurities in close proximity to graphene. The carrier mobility is also researched, demonstrating a decreasing trend of hole mobility in HfO2-GFETs contrast to that in SiO2-GFETs. In a series of HfO2-GFETs with different HfO2 dielectric thickness, the hole mobility shows a tendency of rise when the thickness decreases to 7 nm. The possible reason might be due to the introduced impurities into HfO2 film from atomic layer deposition process, the concentration of which varies from the thickness of HfO2 layer. (C) 2015 AIP Publishing LLC.