Thermomigration in SnPb composite solder joints and wires

被引：0

作者：

Ouyang, Fan-Yi ^{[1
]}

Huang, Annie T. ^{[1
]}

Tu, K. N. ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS | 2006年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Composite flip chip solder joints and composite solder wire samples were used to study thermomigration. The composite solder joint consists of 95Pb5Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Composite wire samples were made by joining Cu (wire)-95 Pb5Sn (ball) eutectic 37Pb63Sn solder (ball)-Cu (wire) together with the size of the wire and ball of 300 gm in diameter. We have observed thermomigration induced composition redistribution of Sn and Pb, in which Sn moved to the hot end and Pb to the cold end. A threshold temperature gradient, which is about 1000 degrees C/cm, is needed to induce the thermomigration.

引用

页码：1974 / +

页数：2

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