Design of Thermal Management Unit with Vertical Throttling Scheme for Proactive Thermal-aware 3D NoC Systems

被引:0
|
作者
Chen, Kun-Chih [1 ]
Lin, Shu-Yen [2 ]
Wu, An-Yeu [1 ]
机构
[1] Natl Taiwan Univ, Grad Inst Elect Engn, Taipei 10617, Taiwan
[2] ITRI, Informat & Commun Res Labs, Hsinchu 31040, Taiwan
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The three-dimensional Network-on-Chip (3D NoC) has been proposed to solve the complex on-chip communication issues. However, the thermal problems become more exacerbated because of the larger power density and the heterogeneous thermal conductance in different silicon layer of 3D NoC. To regulate the system temperature, the Dynamic Thermal Management (DTM) techniques will be triggered when the device is thermal-emergent. However, these kinds of reactive DTM schemes result in significant system performance degradation. In this paper, we propose a proactive DTM with vertical throttling (PDTM-VT) scheme, which is controlled by the distributed Thermal Management Unit (TMU) of each NoC node. Based on the expected temperature resulted from the proposed thermal prediction model, the TMU can early control the temperature of the thermal-emergent device. The experimental results show that the proposed thermal prediction model has less than 0.25% prediction error against actual temperature measurement within 50ms. Besides, the PDTM-VT can reduce 11.84%similar to 23.18% thermalemergent nodes and improve 0.47%similar to 47.90% network throughput.
引用
收藏
页数:4
相关论文
共 50 条
  • [31] Thermal-aware steiner routing for 3D stacked ICs
    Pathak, Mohit
    Lim, Sung Kyu
    [J]. IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2007, : 205 - 211
  • [32] Thermal-aware 3D IC placement via transformation
    Cong, Jason
    Luo, Guojie
    Wei, Jie
    Zhang, Yan
    [J]. PROCEEDINGS OF THE ASP-DAC 2007, 2007, : 780 - +
  • [33] Thermal-aware TSV Repair for Electromigration in 3D ICs
    Wang, Shengcheng
    Tahoori, Mehdi B.
    Chakrabarty, Krishnendu
    [J]. PROCEEDINGS OF THE 2016 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE), 2016, : 1291 - 1296
  • [34] Thermal-Aware Design and Management of Embedded Real-Time Systems
    Lee, Youngmoon
    [J]. PROCEEDINGS OF THE 2021 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2021), 2021, : 1252 - 1255
  • [35] Game-based Congestion-aware Adaptive Routing (GCAR) for Proactive Thermal-aware 3D Network-on-Chip Systems
    Chen, Kun-Chih
    [J]. TENTH INTERNATIONAL WORKSHOP ON NETWORK ON CHIP ARCHITECTURES (NOCARC 2017), 2017,
  • [36] A survey of optimization techniques for thermal-aware 3D processors
    Cao, Kun
    Zhou, Junlong
    Wei, Tongquan
    Chen, Mingsong
    Hu, Shiyan
    Li, Keqin
    [J]. JOURNAL OF SYSTEMS ARCHITECTURE, 2019, 97 : 397 - 415
  • [37] Thermal-Aware Design of 3D ICs with Inter-Tier Liquid Cooling
    Atienza, David
    [J]. 2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST, 2010,
  • [38] Thermal-aware Power Network Design for IR Drop Reduction in 3D ICs
    Li, Zuowei
    Ma, Yuchun
    Zhou, Qiang
    Cai, Yici
    Wang, Yu
    Huang, Tingting
    Xie, Yuan
    [J]. 2012 17TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2012, : 47 - 52
  • [39] Proactive Thermal-Aware Resource Management in Virtualized HPC Cloud Datacenters
    Lee, Eun Kyung
    Viswanathan, Hariharasudhan
    Pompili, Dario
    [J]. IEEE TRANSACTIONS ON CLOUD COMPUTING, 2017, 5 (02) : 234 - 248
  • [40] Dynamic Buffer Allocation for Thermal-aware 3D Network-on-Chip Systems
    Chou, Ciao-Ting
    Lin, Yen-Po
    Chiang, Kai-Yu
    Chen, Kun-Chih
    [J]. 2017 IEEE INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS - TAIWAN (ICCE-TW), 2017,