Power Delivery Network Design and Modeling for High Bandwidth Memory (HBM)

被引：0
|
作者：
Shi, Wenjun [1 ]
Zhou, Yaping [1 ]
Sudhakaran, Sunil [1 ]
机构：
[1] NVIDIA Corp, Santa Clara, CA 95050 USA
来源：
2016 IEEE 25TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS) | 2016年
关键词：
High Bandwidth Memory; simultanuous switching noise; power supply induced jitter;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A modeling method to consider simulation switching noise of HBM and its impact on HBM timing is described. This method combines partial element equivalent circuit model for power delivery network and S-parameters based HBM channel model together in HBM studies.
引用
收藏
页码：3 / 5
页数：3
相关论文
共 50 条
  • [21] Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)
    Kim, Seongguk
    Shin, Taein
    Park, Hyunwook
    Lho, Daehwan
    Son, Keeyoung
    Kim, Keunwoo
    Park, Joonsang
    Choi, Seonguk
    Kim, Jihun
    Kim, Haeyeon
    Kim, Joungho
    2021 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS), 2021,
  • [22] Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)
    Chatterjee, Kamalika
    Li, Yan
    Chang, Hochan
    Damadam, Mohsen
    Asrar, Pouya
    Kim, Jaechoon
    Jeong, Glen
    Kim, WooPoung
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 1054 - 1059
  • [23] High Bandwidth Low Power 2.5D Interconnect Modeling and Design
    Ding, Qian
    Liu, Hui
    Yew, Yee Huan
    Jiang, Jenny
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1832 - 1837
  • [24] Design, analysis, and optimization of DDR2 memory power delivery network
    Lee, Junho
    Kim, Hyunseok
    Kyung, Kimyung
    You, Minyoung
    Lee, Hyungdong
    Park, Kunwoo
    Chung, Byongtae
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2007, : 87 - 90
  • [25] Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module
    Choi, Seonguk
    Son, Keeyoung
    Park, Hyunwook
    Kim, Seongguk
    Sim, Boogyo
    Kim, Jihun
    Park, Joonsang
    Kim, Minsu
    Kim, Haeyeon
    Song, Jinwook
    Kim, Youngwoo
    Kim, Joungho
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (11): : 1804 - 1816
  • [26] Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme
    Kim, Seongguk
    Kim, Subin
    Cho, Kyungjun
    Shin, Taein
    Park, Hyunwook
    Lho, Daehwan
    Park, Shinyoung
    Son, Kyungjune
    Park, Gapyeol
    Jeong, Seungtaek
    Kim, Youngwoo
    Kim, Joungho
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (11): : 1955 - 1970
  • [27] Deep Reinforcement Learning-based Power Distribution Network Structure Design Optimization Method for High Bandwidth Memory Interposer
    Lee, Seonghi
    Kim, Hyunwoong
    Song, Kyunghwan
    Kim, Jongwook
    Park, Dongryul
    Ahn, Jangyong
    Kim, Keunwoo
    Ahn, Seungyoung
    IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021), 2021,
  • [28] Skew cancellation technique for >256-Gbyte/s high-bandwidth memory (HBM)
    Ahn, K.
    Yoo, C.
    ELECTRONICS LETTERS, 2016, 52 (13) : 1155 - 1156
  • [29] Read Disturbance in High Bandwidth Memory: A Detailed Experimental Study on HBM2 DRAM Chips
    Olgun, Ataberk
    Osseiran, Majd
    Yaglikci, A. Giray
    Tugrul, Yahya Can
    Luo, Haocong
    Rhyner, Steve
    Salami, Behzad
    Luna, Juan Gomez
    Mutlu, Onur
    2024 54TH ANNUAL IEEE/IFIP INTERNATIONAL CONFERENCE ON DEPENDABLE SYSTEMS AND NETWORKS, DSN 2024, 2024, : 75 - 89
  • [30] Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer
    Lho, Daehwan
    Park, Hyunwook
    Park, Shinyoung
    Kim, Subin
    Kang, Hyungmin
    Sim, Boogyo
    Kim, Seongguk
    Park, Junyong
    Cho, Kyungjun
    Song, Jinwook
    Kim, Youngwoo
    Kim, Joungho
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2022, 64 (01) : 196 - 208
12345