High resolution negative i-line resist and process for metal lift-off applications

被引：3

作者：

Toukhy, M ^{[1
]}

Mullen, S ^{[1
]}

Lu, PH ^{[1
]}

Neisser, M ^{[1
]}

机构：

[1] Clariant Corp, Somerville, NJ 08876 USA

来源：

ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XIX, PTS 1 AND 2 | 2002年 / 4690卷

关键词：

D O I：

10.1117/12.474287

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A newly developed, high resolution negative i-line resist product family, is introduced in this paper. Variation in resist film absorption provides optimum inverted sidewall slopes adequate for most metal lift-off applications. Resist resolution below 0.3 mum is demonstrated. The capability of further resolution enhancement with the use of a simple shrink process is also demonstrated.

引用

页码：846 / 853

页数：8

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