Elimination of Au-embrittlement in solder joints on Au/Ni metallization

被引：16
|
作者：
Alam, MO
Chan, YC [1 ]
Tu, KN
机构：
[1] City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China
[2] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA
来源：
JOURNAL OF MATERIALS RESEARCH | 2004年 / 19卷 / 05期
关键词：
D O I：
10.1557/jmr.2004.0170
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Systematic experimental work was carried out to understand the mechanism of Au diffusion to the solder interface, and a novel method was proposed to eliminate Au embrittlement by circumventing the continuous layer of (Au,Ni)Sn-4 at the solder interface. Contrary to the usual expectation, it was determined that utilization of a very thin Ni metallization in the Au/Ni/Cu under bump metallization (UBM) was an effective means of maintaining mechanical integrity of the solder joint. It was found that the out-diffusion of Cu during the aging period changes the chemistry and morphology of the intermetallic compounds at the interface.
引用
收藏
页码：1303 / 1306
页数：4
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