Elimination of Au-embrittlement in solder joints on Au/Ni metallization

被引：16
|
作者：
Alam, MO
Chan, YC [1 ]
Tu, KN
机构：
[1] City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China
[2] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA
来源：
JOURNAL OF MATERIALS RESEARCH | 2004年 / 19卷 / 05期
关键词：
D O I：
10.1557/jmr.2004.0170
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Systematic experimental work was carried out to understand the mechanism of Au diffusion to the solder interface, and a novel method was proposed to eliminate Au embrittlement by circumventing the continuous layer of (Au,Ni)Sn-4 at the solder interface. Contrary to the usual expectation, it was determined that utilization of a very thin Ni metallization in the Au/Ni/Cu under bump metallization (UBM) was an effective means of maintaining mechanical integrity of the solder joint. It was found that the out-diffusion of Cu during the aging period changes the chemistry and morphology of the intermetallic compounds at the interface.
引用
收藏
页码：1303 / 1306
页数：4
相关论文
共 50 条
  • [21] Failure analysis of In/Au solder joints
    Ma Lili
    Bao Shengxiang
    Peng Jing
    Du Zhibo
    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 817 - +
  • [22] Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish
    Huang, XJ
    Lee, SWR
    Li, M
    Chen, WT
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 400 - 406
  • [23] Interfacial reaction phenomena of Sn-Pb solder with Au/Ni/Cu metallization
    Alam, MO
    Chan, YC
    CHEMISTRY OF MATERIALS, 2005, 17 (05) : 927 - 930
  • [24] Reliability of BGA solder-joints on the Au/Ni/Cu bond pad-effect of thicknesses of Au and Ni layer
    Alam, M. O.
    Wu, B. Y.
    Chan, Y. C.
    Rufer, Libor
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2006, 6 (03) : 421 - 428
  • [25] Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations
    Lin, Chi-Pu
    Chen, Chih-Ming
    MICROELECTRONICS RELIABILITY, 2012, 52 (02) : 385 - 390
  • [26] Polarity of Electromigration at the Interface between SnPb Solder Joints and Ni/Au Finishes
    Lu Yudong
    He Xiaoqi
    En Yunfei
    Wang Xin
    Zhuang Zhiqiang
    RARE METAL MATERIALS AND ENGINEERING, 2010, 39 (02) : 254 - 257
  • [27] Polarity of electromigration at the interface between SnPb solder joints and Ni/Au finishes
    Lu, Yudong
    He, Xiaoqi
    En, Yunfei
    Wang, Xin
    Zhuang, Zhiqiang
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2010, 39 (02): : 254 - 257
  • [28] The embrittlement mechanism and improvement of impact strength for lead-free solder joints in BGA packaging using electrolytic Ni/Au plating
    Yamamoto, Kenichi
    Kato, Takahiko
    Kawamura, Toshinori
    Nakano, Hiroshi
    Koizumi, Masahiro
    Akahoshi, Haruo
    Satoh, Ryohei
    Welding International, 2009, 23 (07) : 490 - 500
  • [29] An Embrittlement Mechanism of Impact Fracture of Sn-Ag-Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes
    Yamamoto, Kenichi
    Akahoshi, Haruo
    Kato, Takahiko
    Kawamura, Toshinori
    Koizumi, Masahiro
    Satoh, Ryohel
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (04): : 849 - 858
  • [30] Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization
    Hata, Hanae
    Maruya, Yuuki
    Shohji, Ikuo
    MATERIALS TRANSACTIONS, 2016, 57 (06) : 887 - 891
12345