Study on Parameters Optimization in Ultra-precise Processing of Germanium Substrate

被引：2
|
作者：
Lv, X. [1 ]
Yuan, J. L. [1 ]
Wang, Y. Y. [1 ]
Deng, Q. F. [1 ]
机构：
[1] Zhejiang Univ Technol, MOE Key Lab Mech Mfg & Automat, Hangzhou 310032, Zhejiang, Peoples R China
来源：
ULTRA-PRECISION MACHINING TECHNOLOGIES | 2009年 / 69-70卷
关键词：
Semi bonded abrasive lapping; Ge substrate; Machining parameter;
D O I：
10.4028/www.scientific.net/AMR.69-70.442
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.
引用
收藏
页码：442 / 445
页数：4
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