Study on Parameters Optimization in Ultra-precise Processing of Germanium Substrate

被引：2

作者：

Lv, X. ^{[1
]}

Yuan, J. L. ^{[1
]}

Wang, Y. Y. ^{[1
]}

Deng, Q. F. ^{[1
]}

机构：

[1] Zhejiang Univ Technol, MOE Key Lab Mech Mfg & Automat, Hangzhou 310032, Zhejiang, Peoples R China

来源：

ULTRA-PRECISION MACHINING TECHNOLOGIES | 2009年 / 69-70卷

关键词：

Semi bonded abrasive lapping; Ge substrate; Machining parameter;

D O I：

10.4028/www.scientific.net/AMR.69-70.442

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.

引用

页码：442 / 445

页数：4

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